{"id":3439,"date":"2026-03-11T20:33:11","date_gmt":"2026-03-11T19:33:11","guid":{"rendered":"https:\/\/www.logistictronic.com\/?page_id=3439"},"modified":"2026-03-31T23:17:11","modified_gmt":"2026-03-31T21:17:11","slug":"pcb-capabilities","status":"publish","type":"page","link":"https:\/\/www.logistictronic.com\/en\/pcb-capabilities\/","title":{"rendered":"PCB Capabilities"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"3439\" class=\"elementor elementor-3439\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0888d01 e-flex e-con-boxed wpr-particle-no wpr-jarallax-no wpr-parallax-no wpr-sticky-section-no e-con e-parent\" data-id=\"0888d01\" data-element_type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1d61bb0 elementor-widget elementor-widget-html\" data-id=\"1d61bb0\" data-element_type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<style>\n.entry-title, .page-title, h1.title { display: none !important; }\n.pcb-capabilities-wrapper { background-color: #EDF2F7; padding: 60px 20px; font-family: -apple-system, BlinkMacSystemFont, \"Segoe UI\", Roboto, Helvetica, Arial, sans-serif; }\n.pcb-main-title { text-align: center; font-size: 36px; font-weight: 700; color: #000000; margin-bottom: 10px; letter-spacing: -0.5px; }\n.pcb-section-subtitle { text-align: center; font-size: 22px; font-weight: 600; color: #2563EB; margin-bottom: 40px; }\n.pcb-table-card { background: #ffffff; border-radius: 20px; box-shadow: 0 10px 40px rgba(0, 0, 0, 0.04); max-width: 1000px; margin: 0 auto; overflow: hidden; }\n.pcb-table-responsive { overflow-x: auto; -webkit-overflow-scrolling: touch; }\n.pcb-table { width: 100%; border-collapse: collapse; text-align: left; min-width: 700px; }\n.pcb-table th { background-color: #E2E8F0; color: #0F172A; font-weight: 700; padding: 20px 24px; font-size: 14px; text-transform: uppercase; letter-spacing: 0.05em; border-bottom: 2px solid #CBD5E1; }\n.pcb-table td { padding: 20px 24px; border-bottom: 1px solid #E2E8F0; color: #111827; font-size: 15px; vertical-align: top; line-height: 1.6; transition: background-color 0.3s ease, color 0.3s ease; }\n.pcb-table tbody tr:hover td { background-color: #F0F6FF; color: #000000; cursor: default; }\n.pcb-table tr:last-child td { border-bottom: none; }\n.pcb-table td:first-child { font-weight: 600; color: #000000; width: 30%; }\n.pcb-table td:nth-child(2) { width: 40%; font-weight: 500; }\n.pcb-table td.remarks { color: #1F2937; font-size: 14px; width: 30%; }\n\n@media (max-width: 768px) {\n    .pcb-capabilities-wrapper { padding: 140px 15px 60px 15px !important; }\n    .pcb-section-subtitle { font-size: 20px; margin-bottom: 30px; }\n}\n<\/style>\n\n<div class=\"pcb-capabilities-wrapper\">\n    <h3 class=\"pcb-section-subtitle\">Capabilities: Standard PCBs<\/h3>\n\n    <div class=\"pcb-table-card\">\n        <div class=\"pcb-table-responsive\">\n            <table class=\"pcb-table\">\n                <thead>\n                    <tr>\n                        <th>Parameter<\/th>\n                        <th>Production Capacity<\/th>\n                        <th>Notes<\/th>\n                    <\/tr>\n                <\/thead>\n                <tbody>\n                    <tr>\n                        <td>Layer Count<\/td>\n                        <td>1 \u2013 14 layers<\/td>\n                        <td class=\"remarks\">For multilayer boards with 16 layers or more, see \u2018Advanced PCBs'<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Base Material<\/td>\n                        <td>FR-4, aluminum, copper core<\/td>\n                        <td class=\"remarks\">Special materials (High-TG, HDI, Flex) available on request.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Maximum Board Size<\/td>\n                        <td>1\u20132 layers: 600 \u00d7 1200 mm<br>Multilayer: 560 \u00d7 1150 mm<\/td>\n                        <td class=\"remarks\">Minimum manufacturing size: 3 \u00d7 3 mm.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Outline Tolerance<\/td>\n                        <td>\u00b10.2 mm (CNC Milling)<br>\u00b10,5 mm (Ritzen \/ V-Cut)<\/td>\n                        <td class=\"remarks\">Precise mechanical processing according to Gerber data.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Board Thickness<\/td>\n                        <td>0,2 mm \u2013 3,2 mm<\/td>\n                        <td class=\"remarks\">Standard thicknesses: 0.4 \/ 0.6 \/ 0.8 \/ 1.0 \/ 1.2 \/ 1.6 \/ 2.0 mm.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Thickness Tolerance<\/td>\n                        <td>\u00b110% (thickness \u2265 1.0 mm)<br>\u00b10.1 mm (thickness < 1,0 mm)<\/td>\n                        <td class=\"remarks\">Includes tolerances for solder mask and surface finish.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Min. Trace \/ Space<\/td>\n                        <td>0,1 mm \/ 0,1 mm (4 mil)<\/td>\n                        <td class=\"remarks\">Applies to standard copper thickness. HDI provides finer trace geometries.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Outer Layer Copper Thickness<\/td>\n                        <td>35 \u00b5m \u2013 280 \u00b5m (1 oz \u2013 8 oz)<\/td>\n                        <td class=\"remarks\">Extreme copper thickness (&gt; 8 oz) available on request.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Inner Layer Copper Thickness<\/td>\n                        <td>35 \u00b5m \u2013 140 \u00b5m (1 oz \u2013 4 oz)<\/td>\n                        <td class=\"remarks\">Specific layer stack customization possible.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Min. Bohrdurchmesser<\/td>\n                        <td>0.15 mm<\/td>\n                        <td class=\"remarks\">Maximum drill diameter: 6.0 mm.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Min. Restring (Annular Ring)<\/td>\n                        <td>0,15 mm (6 mil)<\/td>\n                        <td class=\"remarks\">Recommended design for maximum reliability.<\/td>\n                    <\/tr>\n                    <tr>\n                        <td>Drill Tolerance (Through Hole)<\/td>\n                        <td>PTH: \u00b10,08 mm<br>NPTH: \u00b10,05 mm<\/td>\n                        <td class=\"remarks\">PTH = Plated Through Hole, NPTH = Non-Plated Through Hole.<\/td>\n                    <\/tr>\n                <\/tbody>\n            <\/table>\n        <\/div>\n    <\/div>\n<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-089a8bb elementor-widget elementor-widget-html\" data-id=\"089a8bb\" data-element_type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<style>\r\n    \/* \u7ee7\u627f\u6807\u51c6\u7248\u7684\u80cc\u666f\u8272\u548c\u6392\u7248\u89c4\u8303 *\/\r\n    .pcb-capabilities-wrapper-advanced {\r\n        background-color: #EDF2F7;\r\n        padding: 20px 20px 60px 20px;\r\n        font-family: -apple-system, BlinkMacSystemFont, \"Segoe UI\", Roboto, Helvetica, Arial, sans-serif;\r\n    }\r\n\r\n    \/* \u5347\u7ea7\u540e\u66f4\u4e13\u4e1a\u7684\u5927\u6807\u9898 *\/\r\n    .pcb-section-subtitle-advanced {\r\n        text-align: center;\r\n        font-size: 24px;\r\n        font-weight: 700;\r\n        color: #2563EB;\r\n        margin-bottom: 40px;\r\n        letter-spacing: -0.3px;\r\n    }\r\n\r\n    .pcb-table-card {\r\n        background: #ffffff;\r\n        border-radius: 20px;\r\n        box-shadow: 0 10px 40px rgba(0, 0, 0, 0.04);\r\n        max-width: 1000px;\r\n        margin: 0 auto;\r\n        overflow: hidden; 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\r\n        color: #000000; \r\n        cursor: default;\r\n    }\r\n\r\n    .pcb-table tr:last-child td {\r\n        border-bottom: none;\r\n    }\r\n\r\n    .pcb-table td:first-child {\r\n        font-weight: 600;\r\n        color: #000000;\r\n        width: 32%; \/* \u7a0d\u5fae\u653e\u5bbd\u7b2c\u4e00\u5217\uff0c\u9002\u5e94\u4e13\u4e1a\u8bcd\u6c47 *\/\r\n    }\r\n    .pcb-table td:nth-child(2) {\r\n        width: 38%;\r\n        font-weight: 500;\r\n    }\r\n    .pcb-table td.remarks {\r\n        color: #1F2937; \r\n        font-size: 14px;\r\n        width: 30%;\r\n    }\r\n<\/style>\r\n\r\n<div class=\"pcb-capabilities-wrapper-advanced\">\r\n    <h3 class=\"pcb-section-subtitle-advanced\">High-End &amp; HDI PCBs<\/h3>\r\n\r\n    <div class=\"pcb-table-card\">\r\n        <div class=\"pcb-table-responsive\">\r\n            <table class=\"pcb-table\">\r\n                <thead>\r\n                    <tr>\r\n                        <th>Technical Parameters<\/th>\r\n                        <th>Specification &amp; Limit<\/th>\r\n                        <th>Notes<\/th>\r\n                    <\/tr>\r\n                <\/thead>\r\n                <tbody>\r\n                    <tr>\r\n                        <td>Number of Layers (High-Layer)<\/td>\r\n                        <td>16 \u2013 24 layers<\/td>\r\n                        <td class=\"remarks\">Ultra-high-layer (&gt;24 layers) available on a project-specific basis upon request.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>HDI Structures<br>(Blind & Buried Vias)<\/td>\r\n                        <td>1+N+1 up to Any-Layer HD<\/td>\r\n                        <td class=\"remarks\">Support for stacked and staggered microvias.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Special Materials<br>(High-Frequency \/ High-Speed)<\/td>\r\n                        <td>Rogers, PTFE, Megtron, Halogen-Free<\/td>\r\n                        <td class=\"remarks\">Hybrid constructions (e.g., FR-4 + Rogers) for optimal cost efficiency possible.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Min. Trace \/ Space<br>(HDI Line \/ Space)<\/td>\r\n                        <td>0,075 mm \/ 0,075 mm (3 mil \/ 3 mil)<\/td>\r\n                        <td class=\"remarks\">BGA features down to 2.5 mil (subject to DFM review).<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Min. Laserbohrung (Microvia)<\/td>\r\n                        <td>0,10 mm (4 mil)<\/td>\r\n                        <td class=\"remarks\">Standard for High-Density BGA Routing.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Max. aspect ratio<br>(Aspect Ratio)<\/td>\r\n                        <td>12:1 (Laser-Vias)<\/td>\r\n                        <td class=\"remarks\">Ratio of PCB thickness to drill diameter.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Hole position tolerance<\/td>\r\n                        <td>\u00b10,05 mm<\/td>\r\n                        <td class=\"remarks\">Highest precision for automated SMT assembly.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Min. BGA pad diameter<\/td>\r\n                        <td>0,15 mm (6 mil)<\/td>\r\n                        <td class=\"remarks\">Optimized for fine-pitch Chip-Scale Packages (CSP) and high-density designs.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Via-in-Pad (VIPPO)<\/td>\r\n                        <td>100% epoxy-filled and overplated<\/td>\r\n                        <td class=\"remarks\">Essential for fine BGA pitches to prevent soldering defects.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Min. solder mask dam<br>(Solder Mask Bridge)<\/td>\r\n                        <td>0,075 mm (3 mil)<\/td>\r\n                        <td class=\"remarks\">Reliably prevents solder bridging between closely spaced IC pins.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Impedance control<\/td>\r\n                        <td>\u00b15% (Tight tolerance)<\/td>\r\n                        <td class=\"remarks\">Tight impedance control for high-speed signals (e.g., USB 3.0, PCIe).<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Controlled-depth routing<br>(Controlled-depth milling &amp; countersink\/counterbore holes)<\/td>\r\n                        <td>Tolerance \u00b10.15 mm<\/td>\r\n                        <td class=\"remarks\">For precise enclosure assembly and complex mechanical designs.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Bow &amp; Twist<br>(Bow & Twist)<\/td>\r\n                        <td>\u2264 0,5 %<\/td>\r\n                        <td class=\"remarks\">Exceeds IPC standards, guaranteeing warpage-free SMT assembly.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Special surface finishes<\/td>\r\n                        <td>ENEPIG, Hartgold, Immersion Ag\/Sn<\/td>\r\n                        <td class=\"remarks\">Selective hard gold (gold fingers) for high-wear edge connectors.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Heavy copper<\/td>\r\n                        <td>Up to 210 \u00b5m (6 oz)<\/td>\r\n                        <td class=\"remarks\">\"Heavy copper layers for power electronics. &gt; 6 oz available on request.<\/td>\r\n                    <\/tr>\r\n                    <tr>\r\n                        <td>Manufacturing Standards &amp; IPC<\/td>\r\n                        <td>IPC-A-600 Class 2 &amp; Class 3<\/td>\r\n                        <td class=\"remarks\">Meeting rigorous quality requirements for industrial and automotive applications.<\/td>\r\n                    <\/tr>\r\n                <\/tbody>\r\n            <\/table>\r\n        <\/div>\r\n    <\/div>\r\n<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-acd34f0 e-flex e-con-boxed wpr-particle-no wpr-jarallax-no wpr-parallax-no wpr-sticky-section-no e-con e-parent\" data-id=\"acd34f0\" data-element_type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0f6b8e3 elementor-widget elementor-widget-html\" data-id=\"0f6b8e3\" data-element_type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<style>\r\n    \/* \u5916\u90e8\u5bb9\u5668\uff1a\u5b8c\u7f8e\u8854\u63a5\u4f60\u7684\u6d45\u7070\u84dd\u80cc\u666f *\/\r\n    .pcb-cert-wrapper {\r\n        background-color: #EDF2F7;\r\n        padding: 80px 20px;\r\n        font-family: -apple-system, BlinkMacSystemFont, \"Segoe UI\", Roboto, Helvetica, Arial, sans-serif;\r\n    }\r\n\r\n    \/* \u6587\u672c\u5185\u5bb9\u533a\u57df *\/\r\n    .cert-header-section {\r\n        max-width: 800px;\r\n        margin: 0 auto 50px auto;\r\n        text-align: center;\r\n    }\r\n\r\n    .cert-main-title {\r\n        font-size: 36px;\r\n        font-weight: 700;\r\n        color: #000000;\r\n        margin-bottom: 16px;\r\n        letter-spacing: -0.5px;\r\n    }\r\n\r\n    .cert-intro-text {\r\n        font-size: 16px;\r\n        line-height: 1.6;\r\n        color: #475569; 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\/* \u54c1\u724c\u84dd *\/\r\n        transition: transform 0.4s ease;\r\n    }\r\n\r\n    \/* \u60ac\u505c\u65f6\u56fe\u6807\u4f1a\u6709\u8f7b\u5fae\u7684\u653e\u5927 *\/\r\n    .cert-card:hover .cert-icon-box {\r\n        transform: scale(1.08);\r\n        background: #2563EB;\r\n        color: #ffffff;\r\n    }\r\n\r\n    .cert-title {\r\n        font-size: 18px;\r\n        font-weight: 700;\r\n        color: #0F172A;\r\n        margin-bottom: 10px;\r\n    }\r\n\r\n    .cert-desc {\r\n        font-size: 14px;\r\n        color: #475569;\r\n        line-height: 1.5;\r\n        margin: 0;\r\n    }\r\n<\/style>\r\n\r\n<div class=\"pcb-cert-wrapper\">\r\n    \r\n    <div class=\"cert-header-section\">\r\n        <h2 class=\"cert-main-title\">Quality &amp; Certifications<\/h2>\r\n        <p class=\"cert-intro-text\">\r\n            Uncompromising quality is the cornerstone of our work. To ensure seamless market authorization for your devices in Europe and worldwide, our entire manufacturing network operates according to the most stringent international guidelines. <strong>All our manufacturing facilities are comprehensively audited and certified.<\/strong>\r\n        <\/p>\r\n    <\/div>\r\n\r\n    <div class=\"cert-grid\">\r\n        \r\n        <div class=\"cert-card\">\r\n            <div class=\"cert-icon-box\">\r\n                <svg width=\"28\" height=\"28\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 12l2 2 4-4m5.618-4.016A11.955 11.955 0 0112 2.944a11.955 11.955 0 01-8.618 3.04A12.02 12.02 0 003 9c0 5.591 3.824 10.29 9 11.622 5.176-1.332 9-6.03 9-11.622 0-1.042-.133-2.052-.382-3.016z\"><\/path><\/svg>\r\n            <\/div>\r\n            <h3 class=\"cert-title\">DIN EN ISO 9001:2015<\/h3>\r\n            <p class=\"cert-desc\">A seamless Quality Management System ensuring end-to-end process reliability and full traceability from order to delivery.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"cert-card\">\r\n            <div class=\"cert-icon-box\">\r\n                <svg width=\"28\" height=\"28\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M10.325 4.317c.426-1.756 2.924-1.756 3.35 0a1.724 1.724 0 002.573 1.066c1.543-.94 3.31.826 2.37 2.37a1.724 1.724 0 001.065 2.572c1.756.426 1.756 2.924 0 3.35a1.724 1.724 0 00-1.066 2.573c.94 1.543-.826 3.31-2.37 2.37a1.724 1.724 0 00-2.572 1.065c-.426 1.756-2.924 1.756-3.35 0a1.724 1.724 0 00-2.573-1.066c-1.543.94-3.31-.826-2.37-2.37a1.724 1.724 0 00-1.065-2.572c-1.756-.426-1.756-2.924 0-3.35a1.724 1.724 0 001.066-2.573c-.94-1.543.826-3.31 2.37-2.37.996.608 2.296.07 2.572-1.065z\"><\/path><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M15 12a3 3 0 11-6 0 3 3 0 016 0z\"><\/path><\/svg>\r\n            <\/div>\r\n            <h3 class=\"cert-title\">IATF 16949 (Automotive)<\/h3>\r\n            <p class=\"cert-desc\">Manufacturing to the highest automotive standards. Guaranteed exceptional reliability and a strict zero-defect management policy.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"cert-card\">\r\n            <div class=\"cert-icon-box\">\r\n                <svg width=\"28\" height=\"28\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M13 10V3L4 14h7v7l9-11h-7z\"><\/path><\/svg>\r\n            <\/div>\r\n            <h3 class=\"cert-title\">UL Recognition (UL 94 V-0)<\/h3>\r\n            <p class=\"cert-desc\">Certified electrical safety and flame retardancy according to Underwriters Laboratories. Essential for both European and US markets.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"cert-card\">\r\n            <div class=\"cert-icon-box\">\r\n                <svg width=\"28\" height=\"28\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M4.318 6.318a4.5 4.5 0 000 6.364L12 20.364l7.682-7.682a4.5 4.5 0 00-6.364-6.364L12 7.636l-1.318-1.318a4.5 4.5 0 00-6.364 0z\"><\/path><\/svg>\r\n            <\/div>\r\n            <h3 class=\"cert-title\">RoHS &amp; REACH Compliant<\/h3>\r\n            <p class=\"cert-desc\">Strict compliance with EU directives on the restriction of hazardous substances (e.g., lead, halogens) for fully eco-friendly electronics.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"cert-card\">\r\n            <div class=\"cert-icon-box\">\r\n                <svg width=\"28\" height=\"28\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M3.055 11H5a2 2 0 012 2v1a2 2 0 002 2 2 2 0 012 2v2.945M8 3.935V5.5A2.5 2.5 0 0010.5 8h.5a2 2 0 012 2 2 2 0 104 0 2 2 0 012-2h1.064M15 20.488V18a2 2 0 012-2h3.064M21 12a9 9 0 11-18 0 9 9 0 0118 0z\"><\/path><\/svg>\r\n            <\/div>\r\n            <h3 class=\"cert-title\">ISO 14001:2015<\/h3>\r\n            <p class=\"cert-desc\">Responsible Environmental Management System. We focus on sustainable manufacturing techniques and resource optimization.<\/p>\r\n        <\/div>\r\n\r\n        <div class=\"cert-card\">\r\n            <div class=\"cert-icon-box\">\r\n                <svg width=\"28\" height=\"28\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><path stroke-linecap=\"round\" stroke-linejoin=\"round\" d=\"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2m-6 9l2 2 4-4\"><\/path><\/svg>\r\n            <\/div>\r\n            <h3 class=\"cert-title\">IPC-A-600: Class 2 vs. Class 3<\/h3>\r\n            <p class=\"cert-desc\">Visual and microscopic inspection of all PCBs in strict accordance with internationally recognized IPC guidelines.<\/p>\r\n        <\/div>\r\n\r\n    <\/div>\r\n<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Kapazit\u00e4ten: Standard-Leiterplatten Parameter Fertigungskapazit\u00e4t Anmerkung Lagenanzahl (Layers) 1 \u2013 14 Lagen F\u00fcr Multilayer ab 16 Lagen siehe &#8222;Erweiterte Leiterplatten&#8220;. Basismaterial FR-4, Aluminium, Kupferkern Sondermaterialien (High-TG, HDI, Flex) auf Anfrage. Max. Leiterplattengr\u00f6\u00dfe 1-\/2-lagig: 600 \u00d7 1200 mmMultilayer: 560 \u00d7 1150 mm Minimale Fertigungsgr\u00f6\u00dfe: 3 \u00d7 3 mm. Konturtoleranz (Outline) \u00b10,2 mm (CNC Fr\u00e4sen)\u00b10,5 mm (Ritzen \/ V-Cut) Exakte mechanische Bearbeitung nach Gerber-Daten. Leiterplattendicke 0,2 mm \u2013 3,2 mm Standarddicken: 0,4 \/ 0,6 \/ 0,8 \/ 1,0 \/ 1,2 \/ 1,6 \/ 2,0 mm. Dickentoleranz \u00b110 % (Dicke \u2265 1,0 mm)\u00b10,1 mm (Dicke < 1,0 mm) Beinhaltet Toleranzen f\u00fcr L\u00f6tstopplack und Finish. Min. Leiterbahn \/ Abstand 0,1 mm \/ 0,1 mm (4 mil) Gilt f\u00fcr Standard-Kupferst\u00e4rke. HDI bietet feinere Strukturen. Kupferdicke Au\u00dfenlagen 35 \u00b5m \u2013 280 \u00b5m (1 oz \u2013 8 oz) Extremer Kupferaufbau (> 8 oz) auf Anfrage m\u00f6glich. Kupferdicke Innenlagen 35 \u00b5m \u2013 140 \u00b5m (1 oz \u2013 4 oz) Spezifische Anpassung nach Lagenaufbau m\u00f6glich. Min. Bohrdurchmesser 0,15 mm Maximaler Bohrdurchmesser: 6,0 mm. Min. Restring (Annular Ring) 0,15 mm (6 mil) Empfohlenes Design f\u00fcr maximale Zuverl\u00e4ssigkeit. Bohrtoleranz (Endloch) PTH: \u00b10,08 mmNPTH: \u00b10,05 mm PTH = Durchkontaktiert, NPTH = Nicht-Durchkontaktiert. High-End &#038; HDI Leiterplatten Technischer Parameter Spezifikation &#038; Limit Anmerkung Lagenanzahl (High-Layer) 16 \u2013 24 Lagen Ultra-High-Layer (>24 Lagen) projektbezogen auf Anfrage realisierbar. HDI-Strukturen(Blind &#038; Buried Vias) 1+N+1 bis Any-Layer HDI Unterst\u00fctzung f\u00fcr gestapelte (stacked) und versetzte (staggered) Microvias. Sondermaterialien(Hochfrequenz \/ High-Speed) Rogers, PTFE, Megtron, Halogenfrei Hybrid-Aufbauten (z. B. FR-4 + Rogers) f\u00fcr optimale Kosten-Effizienz m\u00f6glich. Min. Leiterbahn \/ Abstand(HDI Line \/ Space) 0,075 mm \/ 0,075 mm (3 mil \/ 3 mil) Im BGA-Bereich Strukturen bis 2,5 mil nach vorheriger DFM-Pr\u00fcfung. Min. Laserbohrung (Microvia) 0,10 mm (4 mil) Standard f\u00fcr High-Density BGA-Routing. Max. Aspektverh\u00e4ltnis(Aspect Ratio) 12:1 (Laser-Vias) Verh\u00e4ltnis von Leiterplattendicke zu Bohrdurchmesser. Bohrungspositionstoleranz \u00b10,05 mm H\u00f6chste Pr\u00e4zision f\u00fcr die automatische SMT-Best\u00fcckung. Min. BGA-Pad Durchmesser 0,15 mm (6 mil) Optimiert f\u00fcr feine Chip-Scale-Packages (CSP) und High-Density-Designs. Via-in-Pad (VIPPO) 100 % Epoxidharz gef\u00fcllt &#038; \u00fcberplattiert Zwingend erforderlich f\u00fcr feine BGA-Pitches zur Vermeidung von L\u00f6tfehlern. Min. L\u00f6tstopplack-Steg(Solder Mask Bridge) 0,075 mm (3 mil) Verhindert zuverl\u00e4ssig L\u00f6tbr\u00fccken zwischen dicht stehenden IC-Pins. Impedanzkontrolle \u00b15 % (Pr\u00e4zisionskontrolle) Strenge Impedanzkontrolle f\u00fcr Hochgeschwindigkeitssignale (z. B. USB 3.0, PCIe). Z-Achsen-Bearbeitung(Tiefenfr\u00e4sen &#038; Senkbohrungen) Toleranz \u00b10,15 mm F\u00fcr passgenaue Geh\u00e4usemontage und komplexe mechanische Designs. W\u00f6lbung &#038; Verwindung(Bow &#038; Twist) \u2264 0,5 % \u00dcbertrifft den IPC-Standard. Garantiert verzugsfreie SMT-Montage. Spezielle Oberfl\u00e4chen ENEPIG, Hartgold, Immersion Ag\/Sn Partielles Hartgold (Goldfinger) f\u00fcr hochbeanspruchte Steckkarten-Kontakte. Starkkupfer (Heavy Copper) Bis zu 210 \u00b5m (6 oz) Dicke Kupferlagen f\u00fcr Leistungselektronik. > 6 oz auf Anfrage. Fertigungsstandards &#038; IPC IPC-A-600 Klasse 2 &#038; Klasse 3 Erf\u00fcllung strenger Qualit\u00e4tsanforderungen f\u00fcr Industrie- und Automobilanwendungen. Qualit\u00e4t &#038; Zertifizierungen Kompromisslose Qualit\u00e4t ist das Fundament unserer Arbeit. Um eine reibungslose Marktzulassung Ihrer Endger\u00e4te in Europa und weltweit zu sichern, operiert unser gesamtes Fertigungsnetzwerk nach den strengsten internationalen Richtlinien. Alle unsere Produktionsst\u00e4tten sind vollumf\u00e4nglich auditiert und zertifiziert. DIN EN ISO 9001:2015 L\u00fcckenloses Qualit\u00e4tsmanagementsystem f\u00fcr durchgehende Prozesssicherheit und R\u00fcckverfolgbarkeit von der Bestellung bis zur Auslieferung. IATF 16949 (Automotive) Fertigung nach den h\u00f6chsten Standards der Automobilindustrie. Garantiert extreme Zuverl\u00e4ssigkeit und ein striktes Null-Fehler-Management. UL-Zulassung (UL 94 V-0) Zertifizierte elektrische Sicherheit und Flammwidrigkeit gem\u00e4\u00df Underwriters Laboratories. Essenziell f\u00fcr den europ\u00e4ischen und US-Markt. RoHS &#038; REACH Konform Strikte Einhaltung der EU-Richtlinien zur Beschr\u00e4nkung gef\u00e4hrlicher Stoffe (Blei, Halogene) f\u00fcr absolut umweltfreundliche Elektronik. ISO 14001:2015 Verantwortungsvolles Umweltmanagementsystem. Wir setzen auf nachhaltige Produktionstechniken und Ressourcenoptimierung. IPC-A-600 Klasse 2 \/ 3 Optische und mikroskopische Abnahme aller Leiterplatten strikt nach den international anerkannten IPC-Richtlinien.<\/p>","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_uag_custom_page_level_css":"","site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"full-width-container","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-3439","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>PCB Capabilities | Logistictronic | One-Stop PCB Solution<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.logistictronic.com\/en\/pcb-capabilities\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB Capabilities | Logistictronic | One-Stop PCB Solution\" \/>\n<meta property=\"og:description\" content=\"Kapazit\u00e4ten: Standard-Leiterplatten Parameter Fertigungskapazit\u00e4t Anmerkung Lagenanzahl (Layers) 1 \u2013 14 Lagen F\u00fcr Multilayer ab 16 Lagen siehe &#8222;Erweiterte Leiterplatten&#8220;. Basismaterial FR-4, Aluminium, Kupferkern Sondermaterialien (High-TG, HDI, Flex) auf Anfrage. Max. Leiterplattengr\u00f6\u00dfe 1-\/2-lagig: 600 \u00d7 1200 mmMultilayer: 560 \u00d7 1150 mm Minimale Fertigungsgr\u00f6\u00dfe: 3 \u00d7 3 mm. Konturtoleranz (Outline) \u00b10,2 mm (CNC Fr\u00e4sen)\u00b10,5 mm (Ritzen \/ V-Cut) Exakte mechanische Bearbeitung nach Gerber-Daten. Leiterplattendicke 0,2 mm \u2013 3,2 mm Standarddicken: 0,4 \/ 0,6 \/ 0,8 \/ 1,0 \/ 1,2 \/ 1,6 \/ 2,0 mm. Dickentoleranz \u00b110 % (Dicke \u2265 1,0 mm)\u00b10,1 mm (Dicke &lt; 1,0 mm) Beinhaltet Toleranzen f\u00fcr L\u00f6tstopplack und Finish. Min. Leiterbahn \/ Abstand 0,1 mm \/ 0,1 mm (4 mil) Gilt f\u00fcr Standard-Kupferst\u00e4rke. HDI bietet feinere Strukturen. Kupferdicke Au\u00dfenlagen 35 \u00b5m \u2013 280 \u00b5m (1 oz \u2013 8 oz) Extremer Kupferaufbau (&gt; 8 oz) auf Anfrage m\u00f6glich. Kupferdicke Innenlagen 35 \u00b5m \u2013 140 \u00b5m (1 oz \u2013 4 oz) Spezifische Anpassung nach Lagenaufbau m\u00f6glich. Min. Bohrdurchmesser 0,15 mm Maximaler Bohrdurchmesser: 6,0 mm. Min. Restring (Annular Ring) 0,15 mm (6 mil) Empfohlenes Design f\u00fcr maximale Zuverl\u00e4ssigkeit. Bohrtoleranz (Endloch) PTH: \u00b10,08 mmNPTH: \u00b10,05 mm PTH = Durchkontaktiert, NPTH = Nicht-Durchkontaktiert. High-End &#038; HDI Leiterplatten Technischer Parameter Spezifikation &#038; Limit Anmerkung Lagenanzahl (High-Layer) 16 \u2013 24 Lagen Ultra-High-Layer (&gt;24 Lagen) projektbezogen auf Anfrage realisierbar. HDI-Strukturen(Blind &#038; Buried Vias) 1+N+1 bis Any-Layer HDI Unterst\u00fctzung f\u00fcr gestapelte (stacked) und versetzte (staggered) Microvias. Sondermaterialien(Hochfrequenz \/ High-Speed) Rogers, PTFE, Megtron, Halogenfrei Hybrid-Aufbauten (z. B. FR-4 + Rogers) f\u00fcr optimale Kosten-Effizienz m\u00f6glich. Min. Leiterbahn \/ Abstand(HDI Line \/ Space) 0,075 mm \/ 0,075 mm (3 mil \/ 3 mil) Im BGA-Bereich Strukturen bis 2,5 mil nach vorheriger DFM-Pr\u00fcfung. Min. Laserbohrung (Microvia) 0,10 mm (4 mil) Standard f\u00fcr High-Density BGA-Routing. Max. Aspektverh\u00e4ltnis(Aspect Ratio) 12:1 (Laser-Vias) Verh\u00e4ltnis von Leiterplattendicke zu Bohrdurchmesser. Bohrungspositionstoleranz \u00b10,05 mm H\u00f6chste Pr\u00e4zision f\u00fcr die automatische SMT-Best\u00fcckung. Min. BGA-Pad Durchmesser 0,15 mm (6 mil) Optimiert f\u00fcr feine Chip-Scale-Packages (CSP) und High-Density-Designs. Via-in-Pad (VIPPO) 100 % Epoxidharz gef\u00fcllt &#038; \u00fcberplattiert Zwingend erforderlich f\u00fcr feine BGA-Pitches zur Vermeidung von L\u00f6tfehlern. Min. L\u00f6tstopplack-Steg(Solder Mask Bridge) 0,075 mm (3 mil) Verhindert zuverl\u00e4ssig L\u00f6tbr\u00fccken zwischen dicht stehenden IC-Pins. Impedanzkontrolle \u00b15 % (Pr\u00e4zisionskontrolle) Strenge Impedanzkontrolle f\u00fcr Hochgeschwindigkeitssignale (z. B. USB 3.0, PCIe). Z-Achsen-Bearbeitung(Tiefenfr\u00e4sen &#038; Senkbohrungen) Toleranz \u00b10,15 mm F\u00fcr passgenaue Geh\u00e4usemontage und komplexe mechanische Designs. W\u00f6lbung &#038; Verwindung(Bow &#038; Twist) \u2264 0,5 % \u00dcbertrifft den IPC-Standard. Garantiert verzugsfreie SMT-Montage. Spezielle Oberfl\u00e4chen ENEPIG, Hartgold, Immersion Ag\/Sn Partielles Hartgold (Goldfinger) f\u00fcr hochbeanspruchte Steckkarten-Kontakte. Starkkupfer (Heavy Copper) Bis zu 210 \u00b5m (6 oz) Dicke Kupferlagen f\u00fcr Leistungselektronik. &gt; 6 oz auf Anfrage. Fertigungsstandards &#038; IPC IPC-A-600 Klasse 2 &#038; Klasse 3 Erf\u00fcllung strenger Qualit\u00e4tsanforderungen f\u00fcr Industrie- und Automobilanwendungen. Qualit\u00e4t &#038; Zertifizierungen Kompromisslose Qualit\u00e4t ist das Fundament unserer Arbeit. Um eine reibungslose Marktzulassung Ihrer Endger\u00e4te in Europa und weltweit zu sichern, operiert unser gesamtes Fertigungsnetzwerk nach den strengsten internationalen Richtlinien. Alle unsere Produktionsst\u00e4tten sind vollumf\u00e4nglich auditiert und zertifiziert. DIN EN ISO 9001:2015 L\u00fcckenloses Qualit\u00e4tsmanagementsystem f\u00fcr durchgehende Prozesssicherheit und R\u00fcckverfolgbarkeit von der Bestellung bis zur Auslieferung. IATF 16949 (Automotive) Fertigung nach den h\u00f6chsten Standards der Automobilindustrie. Garantiert extreme Zuverl\u00e4ssigkeit und ein striktes Null-Fehler-Management. UL-Zulassung (UL 94 V-0) Zertifizierte elektrische Sicherheit und Flammwidrigkeit gem\u00e4\u00df Underwriters Laboratories. Essenziell f\u00fcr den europ\u00e4ischen und US-Markt. RoHS &#038; REACH Konform Strikte Einhaltung der EU-Richtlinien zur Beschr\u00e4nkung gef\u00e4hrlicher Stoffe (Blei, Halogene) f\u00fcr absolut umweltfreundliche Elektronik. ISO 14001:2015 Verantwortungsvolles Umweltmanagementsystem. Wir setzen auf nachhaltige Produktionstechniken und Ressourcenoptimierung. 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Basismaterial FR-4, Aluminium, Kupferkern Sondermaterialien (High-TG, HDI, Flex) auf Anfrage. Max. Leiterplattengr\u00f6\u00dfe 1-\/2-lagig: 600 \u00d7 1200 mmMultilayer: 560 \u00d7 1150 mm Minimale Fertigungsgr\u00f6\u00dfe: 3 \u00d7 3 mm. Konturtoleranz (Outline) \u00b10,2 mm (CNC Fr\u00e4sen)\u00b10,5 mm (Ritzen \/ V-Cut) Exakte mechanische Bearbeitung nach Gerber-Daten. Leiterplattendicke 0,2 mm \u2013 3,2 mm Standarddicken: 0,4 \/ 0,6 \/ 0,8 \/ 1,0 \/ 1,2 \/ 1,6 \/ 2,0 mm. Dickentoleranz \u00b110 % (Dicke \u2265 1,0 mm)\u00b10,1 mm (Dicke < 1,0 mm) Beinhaltet Toleranzen f\u00fcr L\u00f6tstopplack und Finish. Min. Leiterbahn \/ Abstand 0,1 mm \/ 0,1 mm (4 mil) Gilt f\u00fcr Standard-Kupferst\u00e4rke. HDI bietet feinere Strukturen. Kupferdicke Au\u00dfenlagen 35 \u00b5m \u2013 280 \u00b5m (1 oz \u2013 8 oz) Extremer Kupferaufbau (> 8 oz) auf Anfrage m\u00f6glich. Kupferdicke Innenlagen 35 \u00b5m \u2013 140 \u00b5m (1 oz \u2013 4 oz) Spezifische Anpassung nach Lagenaufbau m\u00f6glich. Min. Bohrdurchmesser 0,15 mm Maximaler Bohrdurchmesser: 6,0 mm. Min. Restring (Annular Ring) 0,15 mm (6 mil) Empfohlenes Design f\u00fcr maximale Zuverl\u00e4ssigkeit. Bohrtoleranz (Endloch) PTH: \u00b10,08 mmNPTH: \u00b10,05 mm PTH = Durchkontaktiert, NPTH = Nicht-Durchkontaktiert. High-End &#038; HDI Leiterplatten Technischer Parameter Spezifikation &#038; Limit Anmerkung Lagenanzahl (High-Layer) 16 \u2013 24 Lagen Ultra-High-Layer (>24 Lagen) projektbezogen auf Anfrage realisierbar. HDI-Strukturen(Blind &#038; Buried Vias) 1+N+1 bis Any-Layer HDI Unterst\u00fctzung f\u00fcr gestapelte (stacked) und versetzte (staggered) Microvias. Sondermaterialien(Hochfrequenz \/ High-Speed) Rogers, PTFE, Megtron, Halogenfrei Hybrid-Aufbauten (z. B. FR-4 + Rogers) f\u00fcr optimale Kosten-Effizienz m\u00f6glich. Min. Leiterbahn \/ Abstand(HDI Line \/ Space) 0,075 mm \/ 0,075 mm (3 mil \/ 3 mil) Im BGA-Bereich Strukturen bis 2,5 mil nach vorheriger DFM-Pr\u00fcfung. Min. Laserbohrung (Microvia) 0,10 mm (4 mil) Standard f\u00fcr High-Density BGA-Routing. Max. Aspektverh\u00e4ltnis(Aspect Ratio) 12:1 (Laser-Vias) Verh\u00e4ltnis von Leiterplattendicke zu Bohrdurchmesser. Bohrungspositionstoleranz \u00b10,05 mm H\u00f6chste Pr\u00e4zision f\u00fcr die automatische SMT-Best\u00fcckung. Min. BGA-Pad Durchmesser 0,15 mm (6 mil) Optimiert f\u00fcr feine Chip-Scale-Packages (CSP) und High-Density-Designs. Via-in-Pad (VIPPO) 100 % Epoxidharz gef\u00fcllt &#038; \u00fcberplattiert Zwingend erforderlich f\u00fcr feine BGA-Pitches zur Vermeidung von L\u00f6tfehlern. Min. L\u00f6tstopplack-Steg(Solder Mask Bridge) 0,075 mm (3 mil) Verhindert zuverl\u00e4ssig L\u00f6tbr\u00fccken zwischen dicht stehenden IC-Pins. Impedanzkontrolle \u00b15 % (Pr\u00e4zisionskontrolle) Strenge Impedanzkontrolle f\u00fcr Hochgeschwindigkeitssignale (z. B. USB 3.0, PCIe). Z-Achsen-Bearbeitung(Tiefenfr\u00e4sen &#038; Senkbohrungen) Toleranz \u00b10,15 mm F\u00fcr passgenaue Geh\u00e4usemontage und komplexe mechanische Designs. W\u00f6lbung &#038; Verwindung(Bow &#038; Twist) \u2264 0,5 % \u00dcbertrifft den IPC-Standard. Garantiert verzugsfreie SMT-Montage. Spezielle Oberfl\u00e4chen ENEPIG, Hartgold, Immersion Ag\/Sn Partielles Hartgold (Goldfinger) f\u00fcr hochbeanspruchte Steckkarten-Kontakte. Starkkupfer (Heavy Copper) Bis zu 210 \u00b5m (6 oz) Dicke Kupferlagen f\u00fcr Leistungselektronik. > 6 oz auf Anfrage. Fertigungsstandards &#038; IPC IPC-A-600 Klasse 2 &#038; Klasse 3 Erf\u00fcllung strenger Qualit\u00e4tsanforderungen f\u00fcr Industrie- und Automobilanwendungen. Qualit\u00e4t &#038; Zertifizierungen Kompromisslose Qualit\u00e4t ist das Fundament unserer Arbeit. Um eine reibungslose Marktzulassung Ihrer Endger\u00e4te in Europa und weltweit zu sichern, operiert unser gesamtes Fertigungsnetzwerk nach den strengsten internationalen Richtlinien. Alle unsere Produktionsst\u00e4tten sind vollumf\u00e4nglich auditiert und zertifiziert. DIN EN ISO 9001:2015 L\u00fcckenloses Qualit\u00e4tsmanagementsystem f\u00fcr durchgehende Prozesssicherheit und R\u00fcckverfolgbarkeit von der Bestellung bis zur Auslieferung. IATF 16949 (Automotive) Fertigung nach den h\u00f6chsten Standards der Automobilindustrie. Garantiert extreme Zuverl\u00e4ssigkeit und ein striktes Null-Fehler-Management. UL-Zulassung (UL 94 V-0) Zertifizierte elektrische Sicherheit und Flammwidrigkeit gem\u00e4\u00df Underwriters Laboratories. Essenziell f\u00fcr den europ\u00e4ischen und US-Markt. RoHS &#038; REACH Konform Strikte Einhaltung der EU-Richtlinien zur Beschr\u00e4nkung gef\u00e4hrlicher Stoffe (Blei, Halogene) f\u00fcr absolut umweltfreundliche Elektronik. 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