{"id":3488,"date":"2026-03-15T22:09:45","date_gmt":"2026-03-15T21:09:45","guid":{"rendered":"https:\/\/www.logistictronic.com\/?page_id=3488"},"modified":"2026-03-31T23:21:59","modified_gmt":"2026-03-31T21:21:59","slug":"ic-substrate","status":"publish","type":"page","link":"https:\/\/www.logistictronic.com\/en\/ic-substrate\/","title":{"rendered":"IC Substrates"},"content":{"rendered":"<div data-elementor-type=\"wp-page\" data-elementor-id=\"3488\" class=\"elementor elementor-3488\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4bde3f8 e-flex e-con-boxed wpr-particle-no wpr-jarallax-no wpr-parallax-no wpr-sticky-section-no e-con e-parent\" data-id=\"4bde3f8\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b2091a2 elementor-widget elementor-widget-html\" data-id=\"b2091a2\" data-element_type=\"widget\" data-widget_type=\"html.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<style>\n.entry-title, .page-title, h1.title { display: none !important; }\n.ic-pcb-wrapper { background-color: #EDF2F7; padding: 80px 20px; font-family: -apple-system, BlinkMacSystemFont, \"Segoe UI\", Roboto, Helvetica, Arial, sans-serif; }\n.ic-header-box { max-width: 900px; margin: 0 auto 40px auto; text-align: center; background: #ffffff; padding: 50px 60px; border-radius: 24px; box-shadow: 0 4px 20px rgba(0, 0, 0, 0.02); border: 1px solid rgba(226, 232, 240, 0.6); }\n.ic-main-title { font-size: 36px; font-weight: 700; color: #0F172A; margin-bottom: 24px; letter-spacing: -0.5px; line-height: 1.2; }\n.ic-main-title span { color: #2563EB; }\n.ic-intro-text { font-size: 16px; line-height: 1.8; color: #475569; margin: 0; }\n.ic-cta-btn { background-color: #2563EB; color: #ffffff; font-size: 16px; font-weight: 600; padding: 16px 36px; border-radius: 30px; border: none; cursor: pointer; transition: all 0.3s ease; box-shadow: 0 8px 20px rgba(37, 99, 235, 0.2); margin-top: 32px; display: inline-block; text-decoration: none; }\n.ic-cta-btn:hover { background-color: #1D4ED8; transform: translateY(-2px); box-shadow: 0 12px 25px rgba(37, 99, 235, 0.3); }\n.ic-grid { display: grid; grid-template-columns: repeat(2, 1fr); gap: 24px; max-width: 900px; margin: 0 auto 60px auto; }\n.ic-card { background: #ffffff; border-radius: 20px; padding: 36px 30px; border: 1px solid rgba(226, 232, 240, 0.6); box-shadow: 0 4px 15px rgba(0, 0, 0, 0.02); transition: all 0.4s cubic-bezier(0.16, 1, 0.3, 1); display: flex; flex-direction: column; height: 100%; }\n.ic-card:hover { transform: translateY(-5px); box-shadow: 0 15px 35px rgba(37, 99, 235, 0.06); border-color: #BFDBFE; }\n.ic-icon-wrapper { width: 48px; height: 48px; background: #F0F6FF; border-radius: 12px; display: flex; align-items: center; justify-content: center; color: #2563EB; margin-bottom: 24px; transition: transform 0.4s ease, background 0.4s ease; }\n.ic-card:hover .ic-icon-wrapper { transform: scale(1.08); background: #2563EB; color: #ffffff; }\n.ic-card-title { font-size: 19px; font-weight: 700; color: #0F172A; margin-bottom: 12px; margin-top: 0; }\n.ic-card-desc { font-size: 15px; color: #64748B; line-height: 1.65; margin: 0; }\n.ic-table-card { background: #ffffff; border-radius: 20px; box-shadow: 0 10px 40px rgba(0, 0, 0, 0.04); max-width: 1050px; margin: 0 auto; overflow: hidden; border: 1px solid rgba(226, 232, 240, 0.8); }\n.ic-table-title { text-align: center; font-size: 26px; font-weight: 700; color: #0F172A; margin-bottom: 30px; letter-spacing: -0.3px; }\n.ic-table-title span { color: #2563EB; }\n.ic-table-responsive { overflow-x: auto; -webkit-overflow-scrolling: touch; }\n.ic-table { width: 100%; border-collapse: collapse; text-align: left; min-width: 750px; }\n.ic-table th { background-color: #F8FAFC; color: #475569; font-weight: 700; padding: 22px 26px; font-size: 13px; text-transform: uppercase; letter-spacing: 0.08em; border-bottom: 2px solid #E2E8F0; }\n.ic-table td { padding: 22px 26px; border-bottom: 1px solid #F1F5F9; color: #1E293B; font-size: 15px; vertical-align: top; line-height: 1.6; transition: background-color 0.3s ease; }\n.ic-table tbody tr:hover td { background-color: #EFF6FF; color: #0F172A; cursor: default; }\n.ic-table tr:last-child td { border-bottom: none; }\n.ic-table td:first-child { font-weight: 600; color: #0F172A; width: 28%; }\n.ic-table td:nth-child(2) { width: 36%; font-weight: 600; color: #2563EB; }\n.ic-table td.remarks { color: #475569; font-size: 14px; font-weight: 400; width: 36%; }\n.ic-modal-overlay { position: fixed; top: 0; left: 0; width: 100%; height: 100%; background: rgba(15, 23, 42, 0.5); backdrop-filter: blur(5px); z-index: 99999; display: flex; align-items: center; justify-content: center; opacity: 0; visibility: hidden; transition: all 0.3s ease; }\n.ic-modal-overlay.active { opacity: 1; visibility: visible; }\n.ic-modal-box { background: #ffffff; width: 90%; max-width: 500px; border-radius: 24px; padding: 40px; box-shadow: 0 25px 50px -12px rgba(0, 0, 0, 0.25); position: relative; transform: scale(0.95); transition: transform 0.3s ease; }\n.ic-modal-overlay.active .ic-modal-box { transform: scale(1); }\n.ic-modal-close { position: absolute; top: 24px; right: 24px; background: none; border: none; font-size: 24px; color: #94A3B8; cursor: pointer; transition: color 0.2s ease; }\n.ic-modal-close:hover { color: #0F172A; }\n.ic-form-title { font-size: 24px; font-weight: 700; color: #0F172A; margin-bottom: 8px; margin-top: 0; }\n.ic-form-subtitle { font-size: 14px; color: #64748B; margin-bottom: 24px; }\n.ic-input-group { margin-bottom: 20px; text-align: left; }\n.ic-input-group label { display: block; font-size: 14px; font-weight: 600; color: #334155; margin-bottom: 8px; }\n.ic-input-group input[type=\"text\"], .ic-input-group input[type=\"email\"], .ic-input-group textarea, .ic-input-group input[type=\"file\"] { width: 100%; padding: 14px; border: 1px solid #CBD5E1; border-radius: 12px; font-size: 15px; font-family: inherit; color: #0F172A; background-color: #F8FAFC; transition: all 0.3s ease; box-sizing: border-box; }\n.ic-input-group input:focus, .ic-input-group textarea:focus { outline: none; border-color: #2563EB; background-color: #ffffff; box-shadow: 0 0 0 4px rgba(37, 99, 235, 0.1); }\n.ic-input-group textarea { resize: vertical; min-height: 100px; }\n.ic-input-group input[type=\"file\"] { padding: 10px; background-color: #ffffff; cursor: pointer; }\n.ic-submit-btn { width: 100%; background-color: #2563EB; color: #ffffff; font-size: 16px; font-weight: 600; padding: 16px; border-radius: 12px; border: none; cursor: pointer; transition: background-color 0.3s ease; }\n.ic-submit-btn:hover { background-color: #1D4ED8; }\n.ic-submit-btn:disabled { background-color: #94A3B8; cursor: not-allowed; }\n.ic-success-msg { display: none; text-align: center; padding: 40px 0 20px 0; }\n.ic-success-icon { width: 64px; height: 64px; background: #DCFCE7; color: #16A34A; border-radius: 50%; display: flex; align-items: center; justify-content: center; margin: 0 auto 20px auto; }\n@media (max-width: 768px) {\n.ic-pcb-wrapper { padding: 140px 15px 80px 15px !important; }\n.ic-grid { grid-template-columns: 1fr; }\n.ic-header-box { padding: 40px 24px; }\n.ic-modal-box { padding: 30px 20px; }\n}\n<\/style>\n\n<div class=\"ic-pcb-wrapper\">\n    <div class=\"ic-header-box\">\n        <h2 class=\"ic-main-title\">The Foundation of Microelectronics.<br><span>IC-Substrate (Packaging)<\/span><\/h2>\n        <p class=\"ic-intro-text\">\n            In the world of high-performance electronics, IC substrates are the essential link between complex semiconductor chips and standard circuit boards. We provide the advanced material structures and electrical pathways necessary for cutting-edge flip-chip and wire-bonding processes.\n        <\/p>\n        <button class=\"ic-cta-btn\" onclick=\"openIcModal()\">Request a project<\/button>\n    <\/div>\n\n    <div class=\"ic-grid\">\n        <div class=\"ic-card\">\n            <div class=\"ic-icon-wrapper\">\n                <svg width=\"24\" height=\"24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><rect x=\"4\" y=\"4\" width=\"16\" height=\"16\" rx=\"2\" ry=\"2\"><\/rect><rect x=\"9\" y=\"9\" width=\"6\" height=\"6\"><\/rect><line x1=\"9\" y1=\"1\" x2=\"9\" y2=\"4\"><\/line><line x1=\"15\" y1=\"1\" x2=\"15\" y2=\"4\"><\/line><\/svg>\n            <\/div>\n            <h3 class=\"ic-card-title\">mSAP &amp; Fine-Line Technology<\/h3>\n            <p class=\"ic-card-desc\">By using the Modified Semi-Additive Process, we enable trace widths of up to 20 \u00b5m for unprecedented I\/O density.<\/p>\n        <\/div>\n        <div class=\"ic-card\">\n            <div class=\"ic-icon-wrapper\">\n                <svg width=\"24\" height=\"24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><circle cx=\"18\" cy=\"18\" r=\"3\"><\/circle><circle cx=\"6\" cy=\"6\" r=\"3\"><\/circle><path d=\"M13 6h3a2 2 0 0 1 2 2v7\"><\/path><\/svg>\n            <\/div>\n            <h3 class=\"ic-card-title\">Flip-Chip &amp; Wire Bonding<\/h3>\n            <p class=\"ic-card-desc\">Our substrates are precisely tailored to advanced packaging methods. We offer customized carrier boards (BGA, CSP) for wire bonding and flip-chip.<\/p>\n        <\/div>\n        <div class=\"ic-card\">\n            <div class=\"ic-icon-wrapper\">\n                <svg width=\"24\" height=\"24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><polygon points=\"12 2 2 7 12 12 22 7 12 2\"><\/polygon><polyline points=\"2 17 12 22 22 17\"><\/polyline><\/svg>\n            <\/div>\n            <h3 class=\"ic-card-title\">BT Resin Materials<\/h3>\n            <p class=\"ic-card-desc\">Bismaleimide Triazine (BT) provides excellent dimensional stability and thermal compensation between the silicon die and the main PCB.<\/p>\n        <\/div>\n        <div class=\"ic-card\">\n            <div class=\"ic-icon-wrapper\">\n                <svg width=\"24\" height=\"24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"2\" viewbox=\"0 0 24 24\"><path d=\"M22 12h-4l-3 9L9 3l-3 9H2\"><\/path><\/svg>\n            <\/div>\n            <h3 class=\"ic-card-title\">Signal Integrity<\/h3>\n            <p class=\"ic-card-desc\">Tightly controlled material selection and precise routing ensure maximum efficiency in high-speed data transmission.<\/p>\n        <\/div>\n    <\/div>\n\n    <h3 class=\"ic-table-title\">Specifications for <span>IC-Substrate<\/span><\/h3>\n    <div class=\"ic-table-card\">\n        <div class=\"ic-table-responsive\">\n            <table class=\"ic-table\">\n                <thead>\n                    <tr>\n                        <th>Technology &amp; Materials<\/th>\n                        <th>Specification \/ Limit<\/th>\n                        <th>Notes<\/th>\n                    <\/tr>\n                <\/thead>\n                <tbody>\n                    <tr><td>Layer Count<\/td><td>2 to 10 layers<\/td><td class=\"remarks\">Specialized for MCM and System-in-Package (SiP).<\/td><\/tr>\n                    <tr><td>Connection type<\/td><td>Wire Bonding & Flip-Chip<\/td><td class=\"remarks\">Support for gold\/copper wire bonding &amp; bumping.<\/td><\/tr>\n                    <tr><td>Base Material<\/td><td>BT (Bismaleimide Triazine)<\/td><td class=\"remarks\">Extremely low CTE, matching the silicon die.<\/td><\/tr>\n                    <tr><td>Fine-line conductors (mSAP)<\/td><td>Advanced: 20 \u00b5m \/ 20 \u00b5m<\/td><td class=\"remarks\">Routing density far beyond conventional PCBs.<\/td><\/tr>\n                    <tr><td>Cu & Laser Vias<\/td><td>Copper: 9\u201315 \u00b5m | Vias: 50 \u00b5m<\/td><td class=\"remarks\">Ultra-thin copper combined with microvias.<\/td><\/tr>\n                    <tr><td>Surface Finishes<\/td><td>ENEPIG, Soft Gold (EPIG)<\/td><td class=\"remarks\">Industry standard for reliable wire bonding.<\/td><\/tr>\n                <\/tbody>\n            <\/table>\n        <\/div>\n    <\/div>\n\n    <div class=\"ic-modal-overlay\" id=\"icModal\">\n        <div class=\"ic-modal-box\">\n            <button class=\"ic-modal-close\" onclick=\"closeIcModal()\">&times;<\/button>\n            <div id=\"ic-form-body\">\n                <h3 class=\"ic-form-title\">Submit inquiry<\/h3>\n                <form id=\"ic-contact-form\" action=\"\">\n                    <div class=\"ic-input-group\"><label>Your Name \/ Company<\/label><input type=\"text\" name=\"Name\" required><\/div>\n                    <div class=\"ic-input-group\"><label>Email<\/label><input type=\"email\" name=\"Email\" required><\/div>\n                    <div class=\"ic-input-group\"><label>Message *<\/label><textarea name=\"Nachricht\" required><\/textarea><\/div>\n                    <button type=\"submit\" class=\"ic-submit-btn\" id=\"ic-submit-btn\">Submit inquiry<\/button>\n                <input type=\"hidden\" name=\"trp-form-language\" value=\"en\"\/><\/form>\n            <\/div>\n        <\/div>\n    <\/div>\n<\/div>\n\n<script>\nfunction openIcModal() { document.getElementById('icModal').classList.add('active'); }\nfunction closeIcModal() { document.getElementById('icModal').classList.remove('active'); }\nwindow.onclick = function(e) { if (e.target == document.getElementById('icModal')) closeIcModal(); }\ndocument.getElementById('ic-contact-form').addEventListener('submit', function(e) {\n    e.preventDefault();\n    var btn = document.getElementById('ic-submit-btn');\n    btn.innerText = 'Wird gesendet...';\n    fetch('https:\/\/formsubmit.co\/ajax\/el\/ropura', { method: 'POST', body: new FormData(this), headers: { 'Accept': 'application\/json' } })\n    .then(r => r.json()).then(d => { if(d.success) { alert('Gesendet!'); closeIcModal(); } });\n});\n<\/script>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Das Fundament der Mikroelektronik:IC-Substrate (Packaging) In der Welt der High-Performance-Elektronik sind IC-Substrate das unverzichtbare Bindeglied zwischen komplexen Halbleiterchips und der Standard-Leiterplatte. Wir liefern die fortschrittlichen Materialstrukturen und elektrischen Leitwege f\u00fcr modernste Flip-Chip- und Wire-Bonding-Prozesse. Projekt anfragen mSAP &#038; Feinstleiter Durch den Einsatz des Modified Semi-Additive Process erm\u00f6glichen wir Leiterbahnbreiten bis zu 20 \u00b5m f\u00fcr eine beispiellose I\/O-Dichte. Flip-Chip &#038; Wire Bonding Pr\u00e4zise abgestimmt auf fortschrittliche Packaging-Methoden. Wir bieten ma\u00dfgeschneiderte Tr\u00e4gerplatten (BGA, CSP) f\u00fcr Wire-Bonding und Flip-Chip. BT-Harz Materialien Bismaleimide Triazine (BT) bietet exzellente Dimensionsstabilit\u00e4t und thermischen Ausgleich zwischen dem Silizium-Die und der Hauptplatine. Signalintegrit\u00e4t Streng kontrollierte Materialauswahl und exaktes Routing garantieren h\u00f6chste Effizienz bei der High-Speed-Daten\u00fcbertragung. Spezifikationen f\u00fcr IC-Substrate Technologie &#038; Material Spezifikation \/ Limit Anmerkung Lagenanzahl 2 bis 10 Lagen Spezialisiert f\u00fcr MCM und System-in-Package (SiP). Verbindungstyp Wire Bonding &#038; Flip-Chip Unterst\u00fctzung f\u00fcr Gold\/Kupfer-Drahtbonden &#038; Bumping. Basismaterial BT (Bismaleimide Triazine) Extrem niedriger CTE, passend zum Silizium-Die. Feinstleiter (mSAP) Advanced: 20 \u00b5m \/ 20 \u00b5m Routing-Dichte weit jenseits klassischer PCBs. Cu &#038; Laser Vias Kupfer: 9-15 \u00b5m | Vias: 50 \u00b5m Ultrad\u00fcnnes Kupfer kombiniert mit Microvias. Oberfl\u00e4chen ENEPIG, Soft Gold (EPIG) Branchenstandard f\u00fcr zuverl\u00e4ssiges Wire-Bonding. &times; Anfrage senden Ihr Name \/ Firma * E-Mail * Nachricht * Anfrage absenden<\/p>","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_uag_custom_page_level_css":"","site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"full-width-container","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-3488","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>IC Substrates | Logistictronic | One-Stop PCB Solution<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.logistictronic.com\/en\/ic-substrate\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"IC Substrates | Logistictronic | One-Stop PCB Solution\" \/>\n<meta property=\"og:description\" content=\"Das Fundament der Mikroelektronik:IC-Substrate (Packaging) In der Welt der High-Performance-Elektronik sind IC-Substrate das unverzichtbare Bindeglied zwischen komplexen Halbleiterchips und der Standard-Leiterplatte. Wir liefern die fortschrittlichen Materialstrukturen und elektrischen Leitwege f\u00fcr modernste Flip-Chip- und Wire-Bonding-Prozesse. Projekt anfragen mSAP &#038; Feinstleiter Durch den Einsatz des Modified Semi-Additive Process erm\u00f6glichen wir Leiterbahnbreiten bis zu 20 \u00b5m f\u00fcr eine beispiellose I\/O-Dichte. Flip-Chip &#038; Wire Bonding Pr\u00e4zise abgestimmt auf fortschrittliche Packaging-Methoden. Wir bieten ma\u00dfgeschneiderte Tr\u00e4gerplatten (BGA, CSP) f\u00fcr Wire-Bonding und Flip-Chip. BT-Harz Materialien Bismaleimide Triazine (BT) bietet exzellente Dimensionsstabilit\u00e4t und thermischen Ausgleich zwischen dem Silizium-Die und der Hauptplatine. Signalintegrit\u00e4t Streng kontrollierte Materialauswahl und exaktes Routing garantieren h\u00f6chste Effizienz bei der High-Speed-Daten\u00fcbertragung. Spezifikationen f\u00fcr IC-Substrate Technologie &#038; Material Spezifikation \/ Limit Anmerkung Lagenanzahl 2 bis 10 Lagen Spezialisiert f\u00fcr MCM und System-in-Package (SiP). Verbindungstyp Wire Bonding &#038; Flip-Chip Unterst\u00fctzung f\u00fcr Gold\/Kupfer-Drahtbonden &#038; Bumping. Basismaterial BT (Bismaleimide Triazine) Extrem niedriger CTE, passend zum Silizium-Die. Feinstleiter (mSAP) Advanced: 20 \u00b5m \/ 20 \u00b5m Routing-Dichte weit jenseits klassischer PCBs. Cu &#038; Laser Vias Kupfer: 9-15 \u00b5m | Vias: 50 \u00b5m Ultrad\u00fcnnes Kupfer kombiniert mit Microvias. Oberfl\u00e4chen ENEPIG, Soft Gold (EPIG) Branchenstandard f\u00fcr zuverl\u00e4ssiges Wire-Bonding. &times; Anfrage senden Ihr Name \/ Firma * E-Mail * Nachricht * Anfrage absenden\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.logistictronic.com\/en\/ic-substrate\/\" \/>\n<meta property=\"og:site_name\" content=\"Logistictronic | One-Stop PCB Solution\" \/>\n<meta property=\"article:modified_time\" content=\"2026-03-31T21:21:59+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/ic-substrate\\\/\",\"url\":\"https:\\\/\\\/www.logistictronic.com\\\/ic-substrate\\\/\",\"name\":\"IC Substrates | Logistictronic | One-Stop PCB Solution\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/#website\"},\"datePublished\":\"2026-03-15T21:09:45+00:00\",\"dateModified\":\"2026-03-31T21:21:59+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/ic-substrate\\\/#breadcrumb\"},\"inLanguage\":\"en-GB\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.logistictronic.com\\\/ic-substrate\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/ic-substrate\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.logistictronic.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"IC Substrates\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/#website\",\"url\":\"https:\\\/\\\/www.logistictronic.com\\\/\",\"name\":\"Logistictronic | One-Stop PCB Solution\",\"description\":\"From Design to Delivery\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.logistictronic.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-GB\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/#organization\",\"name\":\"Logistictronic | One-Stop PCB Solution\",\"url\":\"https:\\\/\\\/www.logistictronic.com\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-GB\",\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.logistictronic.com\\\/wp-content\\\/uploads\\\/2025\\\/10\\\/cropped-logoloukong-2.png\",\"contentUrl\":\"https:\\\/\\\/www.logistictronic.com\\\/wp-content\\\/uploads\\\/2025\\\/10\\\/cropped-logoloukong-2.png\",\"width\":1536,\"height\":512,\"caption\":\"Logistictronic | One-Stop PCB Solution\"},\"image\":{\"@id\":\"https:\\\/\\\/www.logistictronic.com\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"IC Substrates | Logistictronic | One-Stop PCB Solution","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.logistictronic.com\/en\/ic-substrate\/","og_locale":"en_GB","og_type":"article","og_title":"IC Substrates | Logistictronic | One-Stop PCB Solution","og_description":"Das Fundament der Mikroelektronik:IC-Substrate (Packaging) In der Welt der High-Performance-Elektronik sind IC-Substrate das unverzichtbare Bindeglied zwischen komplexen Halbleiterchips und der Standard-Leiterplatte. Wir liefern die fortschrittlichen Materialstrukturen und elektrischen Leitwege f\u00fcr modernste Flip-Chip- und Wire-Bonding-Prozesse. Projekt anfragen mSAP &#038; Feinstleiter Durch den Einsatz des Modified Semi-Additive Process erm\u00f6glichen wir Leiterbahnbreiten bis zu 20 \u00b5m f\u00fcr eine beispiellose I\/O-Dichte. Flip-Chip &#038; Wire Bonding Pr\u00e4zise abgestimmt auf fortschrittliche Packaging-Methoden. Wir bieten ma\u00dfgeschneiderte Tr\u00e4gerplatten (BGA, CSP) f\u00fcr Wire-Bonding und Flip-Chip. BT-Harz Materialien Bismaleimide Triazine (BT) bietet exzellente Dimensionsstabilit\u00e4t und thermischen Ausgleich zwischen dem Silizium-Die und der Hauptplatine. Signalintegrit\u00e4t Streng kontrollierte Materialauswahl und exaktes Routing garantieren h\u00f6chste Effizienz bei der High-Speed-Daten\u00fcbertragung. Spezifikationen f\u00fcr IC-Substrate Technologie &#038; Material Spezifikation \/ Limit Anmerkung Lagenanzahl 2 bis 10 Lagen Spezialisiert f\u00fcr MCM und System-in-Package (SiP). Verbindungstyp Wire Bonding &#038; Flip-Chip Unterst\u00fctzung f\u00fcr Gold\/Kupfer-Drahtbonden &#038; Bumping. Basismaterial BT (Bismaleimide Triazine) Extrem niedriger CTE, passend zum Silizium-Die. Feinstleiter (mSAP) Advanced: 20 \u00b5m \/ 20 \u00b5m Routing-Dichte weit jenseits klassischer PCBs. Cu &#038; Laser Vias Kupfer: 9-15 \u00b5m | Vias: 50 \u00b5m Ultrad\u00fcnnes Kupfer kombiniert mit Microvias. Oberfl\u00e4chen ENEPIG, Soft Gold (EPIG) Branchenstandard f\u00fcr zuverl\u00e4ssiges Wire-Bonding. &times; Anfrage senden Ihr Name \/ Firma * E-Mail * Nachricht * Anfrage absenden","og_url":"https:\/\/www.logistictronic.com\/en\/ic-substrate\/","og_site_name":"Logistictronic | One-Stop PCB Solution","article_modified_time":"2026-03-31T21:21:59+00:00","twitter_card":"summary_large_image","twitter_misc":{"Estimated reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.logistictronic.com\/ic-substrate\/","url":"https:\/\/www.logistictronic.com\/ic-substrate\/","name":"IC Substrates | Logistictronic | One-Stop PCB Solution","isPartOf":{"@id":"https:\/\/www.logistictronic.com\/#website"},"datePublished":"2026-03-15T21:09:45+00:00","dateModified":"2026-03-31T21:21:59+00:00","breadcrumb":{"@id":"https:\/\/www.logistictronic.com\/ic-substrate\/#breadcrumb"},"inLanguage":"en-GB","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.logistictronic.com\/ic-substrate\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.logistictronic.com\/ic-substrate\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.logistictronic.com\/"},{"@type":"ListItem","position":2,"name":"IC Substrates"}]},{"@type":"WebSite","@id":"https:\/\/www.logistictronic.com\/#website","url":"https:\/\/www.logistictronic.com\/","name":"Logistictronic | One-Stop PCB Solution","description":"From Design to Delivery","publisher":{"@id":"https:\/\/www.logistictronic.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.logistictronic.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-GB"},{"@type":"Organization","@id":"https:\/\/www.logistictronic.com\/#organization","name":"Logistictronic | One-Stop PCB Solution","url":"https:\/\/www.logistictronic.com\/","logo":{"@type":"ImageObject","inLanguage":"en-GB","@id":"https:\/\/www.logistictronic.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.logistictronic.com\/wp-content\/uploads\/2025\/10\/cropped-logoloukong-2.png","contentUrl":"https:\/\/www.logistictronic.com\/wp-content\/uploads\/2025\/10\/cropped-logoloukong-2.png","width":1536,"height":512,"caption":"Logistictronic | One-Stop PCB Solution"},"image":{"@id":"https:\/\/www.logistictronic.com\/#\/schema\/logo\/image\/"}}]}},"uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"trp-custom-language-flag":false},"uagb_author_info":{"display_name":"wordpressadmin","author_link":"https:\/\/www.logistictronic.com\/en\/author\/wordpressadmin\/"},"uagb_comment_info":0,"uagb_excerpt":"Das Fundament der Mikroelektronik:IC-Substrate (Packaging) In der Welt der High-Performance-Elektronik sind IC-Substrate das unverzichtbare Bindeglied zwischen komplexen Halbleiterchips und der Standard-Leiterplatte. Wir liefern die fortschrittlichen Materialstrukturen und elektrischen Leitwege f\u00fcr modernste Flip-Chip- und Wire-Bonding-Prozesse. Projekt anfragen mSAP &#038; Feinstleiter Durch den Einsatz des Modified Semi-Additive Process erm\u00f6glichen wir Leiterbahnbreiten bis zu 20 \u00b5m f\u00fcr eine&hellip;","_links":{"self":[{"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/pages\/3488","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/comments?post=3488"}],"version-history":[{"count":8,"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/pages\/3488\/revisions"}],"predecessor-version":[{"id":3728,"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/pages\/3488\/revisions\/3728"}],"wp:attachment":[{"href":"https:\/\/www.logistictronic.com\/en\/wp-json\/wp\/v2\/media?parent=3488"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}