Precision for the GHz Era:
High-frequency printed circuit boards
High-frequency printed circuit boards (HF PCBs) are the backbone of cutting-edge technologies in 5G telecommunications, aerospace, and medical technology. We master this complex interplay of advanced materials, precise DFM engineering, and strict impedance control.
Special Materials (Dk & Df)
Precise control of the dielectric constant (Dk) and an extremely low loss factor (Df) are crucial. We process high-end laminates (e.g., Rogers, PTFE) for minimal signal loss.
Signal Integrity
To prevent signal distortion, we use low-profile copper foils and specific laminate weaves. The copper design is precisely calibrated to meet high-frequency requirements.
Thermal Management
High-frequency circuits often generate concentrated heat. Through intelligent layer stack-ups and thermal vias, we ensure long-term performance.
DFM Collaboration
We review your layouts at an early stage to ensure optimal alignment of cost, material, and performance objectives.
Specifications for HF & Microwave PCBs
| Material & Technology | Specification / Availability | Notes |
|---|---|---|
| High-Frequency Material (Rogers Corporation) |
RO4000® (e.g., RO4350B), RO3000®, AD series, RT-duroid®, TMM® | The global industry standard. On request, we offer alternative PFAS-free solutions (Non-PFAS) to meet the highest environmental standards. |
| High-Frequency Material (AGC / Taconic) |
RF-35 Series, RF-60TC, TLX, TLY, TSM-DS3 Series | Excellent PTFE laminates for demanding microwave and radar applications. |
| Hybrid Stack-up (Mixed Dielectric) |
Cost-efficient: Expensive HF material is used only on the critical outer layers, with FR-4 for the inner layer construction. | Reduces the skin effect and significantly minimizes signal loss (insertion loss) at extremely high frequencies. |
| Copper Foil Technology | Low-Profile (LP) & Very-Low-Profile (VLP) Kupfer | Reduces the skin effect and significantly minimizes signal loss (insertion loss) at extremely high frequencies. |
| Strictly controlled manufacturing processes to ensure perfect signal integrity (single-ended & differential). | Tolerance ±5% to ±8% | Strictly controlled manufacturing processes to ensure perfect signal integrity (single-ended & differential). |
| Optimized Surface Finishes | Immersion Silver (ImAg), Immersion Tin, ENEPIG, OSP | ENIG (Electroless Nickel Immersion Gold) is often avoided for high-frequency designs, as the nickel layer causes signal attenuation. We provide proactive guidance. |