Ultimate Thermal Management:
Metal core printed circuit boards (IMS)
IMS printed circuit boards (Insulated Metal Substrate) are the first choice when standard FR-4 reaches its thermal limits. By combining a robust metal core with a highly thermally conductive dielectric, they provide outstanding heat dissipation—ideal for high-power LEDs and power electronics.
Maximum Thermal Performance
The thermal resistance of an IMS PCB is up to 100 times lower than that of standard FR-4. This reliably protects your components from overheating.
High Dielectric Strength
The specialized dielectric not only ensures rapid heat transfer but also provides excellent dielectric strength for power supplies.
Mechanical Strength
The solid metal core provides extremely high stability. Ideal for applications with strong vibrations or mechanical stresses.
Wide Range of Applications
The perfect solution for high-intensity LEDs, automotive lighting, motor controls, and high-current SMD applications.
Advanced Manufacturing Capabilities for IMS-Leiterplatten
| Technology & Materials | Specification / Limit | Notes |
|---|---|---|
| Base Materials (Substrates) |
Aluminum & Copper Plates FR-4, PTFE, Thermo-Dielectrics |
High-quality material combinations for optimal connection of isolated circuits using thermal prepreg or resin systems. |
| Thermal Conductivity | 1.0 W/m·K to 12.0 W/m·K | Extremely high thermal conductivity (high-end range) for the most demanding power LEDs and power electronics. |
| Dielectric Layer Thickness (Insulation Layer) |
0,05 mm – 0,20 mm | Perfect balance: ultra-thin for minimal thermal resistance while maintaining maximum dielectric strength. |
| Copper Layer & Metal Core Thickness |
Copper: 35 µm – 140 µm (Final Thickness) Metallkern: 0,40 mm – 3,20 mm |
Supports high currents (Heavy Copper) and provides massive mechanical stability with optimal heat dissipation. |
| Fine-Line Technology (Minimum Track / Gap) |
0,10 mm / 0,10 mm (100 µm) | Precise etching processes enable high-density and complex circuit layouts even on solid metal substrates. |
| Drilling technology (Mechanisch & Laser) |
Mechanical Drilling: from 0.30 mm Laser-Vias: 0,10 mm (Std) / 0,075 mm (Adv) |
Advanced laser drilling (up to 75 µm) for complex HDI architectures on IMS substrates |
| Mechanical Forming (Routing & Profiling) |
Punching & Liquid-Cooled Milling |
Liquid-cooled milling ensures burr-free edges and exceptional dimensional accuracy for panels up to 550 × 700 mm. |
| Surface finish (Surface Finishes) |
Comprehensive selection of surface finishes, perfectly tailored for COB (Chip-on-Board) and advanced soldering processes. | Comprehensive range of surface finishes, perfectly tailored for COB (Chip-on-Board) and demanding soldering processes. |