Unlimited 3D Design Freedom:
Flexible and rigid-flex printed circuit boards
Flexible and rigid-flex printed circuit boards combine the robustness of rigid assemblies with the dynamic flexibility of polyimide films. By eliminating error-prone connectors and cable harnesses, they maximize space utilization and ensure the highest contact reliability. Whether single-sided flex circuits for medical technology or highly complex 36-layer rigid-flex constructions for aerospace – we implement your most demanding miniaturization concepts according to the strictest IPC standards.
Weight & Space Savings
By bending and folding, these boards fit perfectly into the tightest 3D enclosures. Replacing bulky cables and connectors saves significant weight and space – ideal for portable devices (wearables) and sensors.
Maximum Reliability
Reduced interfaces mean fewer potential sources of error. The monolithic, plated-through Starrflex system withstands extreme dynamic bending cycles and mechanical vibrations significantly better than conventional wiring.
IPC-Compliant Structures
Manufacturing according to IPC-6013 (Type 1 to 4) and IPC-2223 design guidelines. We use high-quality, adhesive-free polyimide materials (PI) to ensure excellent thermal stability and longevity.
Reduced Total Cost (TCO)
Although the bare PCB is more complex, the total cost of the end product often decreases significantly, as time-consuming assembly, soldering, and cable harnessing work is completely eliminated.
Specifications for Flex & Rigid-Flex PCBs
| Technology & Materials | Specification / Limit | Notes |
|---|---|---|
| Layer Count (Layer Count) | Flex PCBs: 1 to 12 layers Rigid-Flex: 2 to 36 layers | Supports symmetrical and asymmetrical layer constructions (bookbinder technology) for maximum design flexibility. |
| Fine-Line Technology (Minimum Track / Gap) | 0,05 mm / 0,05 mm (50 µm) | Enables ultra-compact HDI designs in demanding, miniaturized flex applications. |
| Drilling technology (Min. Vias) | Mechanical: from 0.15 mm Laser vias: from 0.05 mm (50 µm) | High-precision laser drilling for microvias and any-layer connections in high-density HDI rigid-flex architectures. |
| Copper thickness (Copper Weight) | 9 µm (¼ oz) bis 210 µm (6 oz) | Ultra-thin rolled copper (RA) for maximum dynamic bending cycles, as well as heavy copper for power components. |
| Maximum Dimensions | Standard: 450 x 610 mm Special: up to 1500 mm | Production of extra-long flex PCBs for specialized sensors, lighting, or medical technology. |
| Quality Standards & Certifications | IPC-6013 (Type 1-4), IPC-2223, UL94 V-0 certified | Strictest testing procedures. Applying the UL logo to your assemblies is possible at no extra charge. |
| Surface finish (Surface Finishes) | ENIG, OSP, Immersion Tin / Silver, Hard Gold (Goldfingers) | Including electroplated hard gold for highly reliable, wear-resistant connectors (ZIF contacts) |