HDI PCB
HDI (High Density Interconnect) PCBs use extremely fine structures to push the limits of what is possible. By employing micro-vias (blind & buried) and ultra-fine traces (often below 0.1 mm), we achieve an unprecedented packing density.
We offer state-of-the-art manufacturing with up to 4 Laminationszyklen, 1.5 mil trace width and via-in-pad technology for your most demanding innovations.
Maximum Density
More performance in the smallest space. Ideal for compact designs such as smartphones and wearables, without compromising functionality.
Signal Integrity
Shorter paths and optimized vias minimize signal loss and reflections. Perfect for high-speed data transmissions.
Higher Reliability
Improved thermal properties and mechanical stability through advanced layer stacking and micro-via technology.
Cost Efficiency
By reducing the number of layers and material usage, complex designs can be implemented more cost-effectively.
Design of Low-Loss Materials for High-Frequency PCBs
Choosing the right raw material is crucial. The dielectric constant (Dk) and loss factor (Df) directly affect signal loss and integrity. We rely on materials that ensure minimal attenuation and maximum heat resistance.
Rogers
The first choice for RF and microwave applications. Rogers materials offer extremely low Dk and Df values—ideal for demanding 5G technology and military applications.
Taconic
Known for high efficiency and low dielectric losses. Taconic laminates are used worldwide in high-frequency communications and high-speed circuits.
PTFE (Teflon)
Due to its excellent dielectric properties (low Dk & Df), PTFE is the standard for microwave PCBs. It effectively resists signal loss at high frequencies.
Our Material Partners
To ensure top performance, we work only with the global market leaders.