The Foundation of Microelectronics.
IC-Substrate (Packaging)
In the world of high-performance electronics, IC substrates are the essential link between complex semiconductor chips and standard circuit boards. We provide the advanced material structures and electrical pathways necessary for cutting-edge flip-chip and wire-bonding processes.
mSAP & Fine-Line Technology
By using the Modified Semi-Additive Process, we enable trace widths of up to 20 µm for unprecedented I/O density.
Flip-Chip & Wire Bonding
Our substrates are precisely tailored to advanced packaging methods. We offer customized carrier boards (BGA, CSP) for wire bonding and flip-chip.
BT Resin Materials
Bismaleimide Triazine (BT) provides excellent dimensional stability and thermal compensation between the silicon die and the main PCB.
Signal Integrity
Tightly controlled material selection and precise routing ensure maximum efficiency in high-speed data transmission.
Specifications for IC-Substrate
| Technology & Materials | Specification / Limit | Notes |
|---|---|---|
| Layer Count | 2 to 10 layers | Specialized for MCM and System-in-Package (SiP). |
| Connection type | Wire Bonding & Flip-Chip | Support for gold/copper wire bonding & bumping. |
| Base Material | BT (Bismaleimide Triazine) | Extremely low CTE, matching the silicon die. |
| Fine-line conductors (mSAP) | Advanced: 20 µm / 20 µm | Routing density far beyond conventional PCBs. |
| Cu & Laser Vias | Copper: 9–15 µm | Vias: 50 µm | Ultra-thin copper combined with microvias. |
| Surface Finishes | ENEPIG, Soft Gold (EPIG) | Industry standard for reliable wire bonding. |