Capabilities: Standard PCBs
| Parameter | Production Capacity | Notes |
|---|---|---|
| Layer Count | 1 – 14 layers | For multilayer boards with 16 layers or more, see ‘Advanced PCBs' |
| Base Material | FR-4, aluminum, copper core | Special materials (High-TG, HDI, Flex) available on request. |
| Maximum Board Size | 1–2 layers: 600 × 1200 mm Multilayer: 560 × 1150 mm |
Minimum manufacturing size: 3 × 3 mm. |
| Outline Tolerance | ±0.2 mm (CNC Milling) ±0,5 mm (Ritzen / V-Cut) |
Precise mechanical processing according to Gerber data. |
| Board Thickness | 0,2 mm – 3,2 mm | Standard thicknesses: 0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 mm. |
| Thickness Tolerance | ±10% (thickness ≥ 1.0 mm) ±0.1 mm (thickness < 1,0 mm) |
Includes tolerances for solder mask and surface finish. |
| Min. Trace / Space | 0,1 mm / 0,1 mm (4 mil) | Applies to standard copper thickness. HDI provides finer trace geometries. |
| Outer Layer Copper Thickness | 35 µm – 280 µm (1 oz – 8 oz) | Extreme copper thickness (> 8 oz) available on request. |
| Inner Layer Copper Thickness | 35 µm – 140 µm (1 oz – 4 oz) | Specific layer stack customization possible. |
| Min. Bohrdurchmesser | 0.15 mm | Maximum drill diameter: 6.0 mm. |
| Min. Restring (Annular Ring) | 0,15 mm (6 mil) | Recommended design for maximum reliability. |
| Drill Tolerance (Through Hole) | PTH: ±0,08 mm NPTH: ±0,05 mm |
PTH = Plated Through Hole, NPTH = Non-Plated Through Hole. |
High-End & HDI PCBs
| Technical Parameters | Specification & Limit | Notes |
|---|---|---|
| Number of Layers (High-Layer) | 16 – 24 layers | Ultra-high-layer (>24 layers) available on a project-specific basis upon request. |
| HDI Structures (Blind & Buried Vias) |
1+N+1 up to Any-Layer HD | Support for stacked and staggered microvias. |
| Special Materials (High-Frequency / High-Speed) |
Rogers, PTFE, Megtron, Halogen-Free | Hybrid constructions (e.g., FR-4 + Rogers) for optimal cost efficiency possible. |
| Min. Trace / Space (HDI Line / Space) |
0,075 mm / 0,075 mm (3 mil / 3 mil) | BGA features down to 2.5 mil (subject to DFM review). |
| Min. Laserbohrung (Microvia) | 0,10 mm (4 mil) | Standard for High-Density BGA Routing. |
| Max. aspect ratio (Aspect Ratio) |
12:1 (Laser-Vias) | Ratio of PCB thickness to drill diameter. |
| Hole position tolerance | ±0,05 mm | Highest precision for automated SMT assembly. |
| Min. BGA pad diameter | 0,15 mm (6 mil) | Optimized for fine-pitch Chip-Scale Packages (CSP) and high-density designs. |
| Via-in-Pad (VIPPO) | 100% epoxy-filled and overplated | Essential for fine BGA pitches to prevent soldering defects. |
| Min. solder mask dam (Solder Mask Bridge) |
0,075 mm (3 mil) | Reliably prevents solder bridging between closely spaced IC pins. |
| Impedance control | ±5% (Tight tolerance) | Tight impedance control for high-speed signals (e.g., USB 3.0, PCIe). |
| Controlled-depth routing (Controlled-depth milling & countersink/counterbore holes) |
Tolerance ±0.15 mm | For precise enclosure assembly and complex mechanical designs. |
| Bow & Twist (Bow & Twist) |
≤ 0,5 % | Exceeds IPC standards, guaranteeing warpage-free SMT assembly. |
| Special surface finishes | ENEPIG, Hartgold, Immersion Ag/Sn | Selective hard gold (gold fingers) for high-wear edge connectors. |
| Heavy copper | Up to 210 µm (6 oz) | "Heavy copper layers for power electronics. > 6 oz available on request. |
| Manufacturing Standards & IPC | IPC-A-600 Class 2 & Class 3 | Meeting rigorous quality requirements for industrial and automotive applications. |
Quality & Certifications
Uncompromising quality is the cornerstone of our work. To ensure seamless market authorization for your devices in Europe and worldwide, our entire manufacturing network operates according to the most stringent international guidelines. All our manufacturing facilities are comprehensively audited and certified.
DIN EN ISO 9001:2015
A seamless Quality Management System ensuring end-to-end process reliability and full traceability from order to delivery.
IATF 16949 (Automotive)
Manufacturing to the highest automotive standards. Guaranteed exceptional reliability and a strict zero-defect management policy.
UL Recognition (UL 94 V-0)
Certified electrical safety and flame retardancy according to Underwriters Laboratories. Essential for both European and US markets.
RoHS & REACH Compliant
Strict compliance with EU directives on the restriction of hazardous substances (e.g., lead, halogens) for fully eco-friendly electronics.
ISO 14001:2015
Responsible Environmental Management System. We focus on sustainable manufacturing techniques and resource optimization.
IPC-A-600: Class 2 vs. Class 3
Visual and microscopic inspection of all PCBs in strict accordance with internationally recognized IPC guidelines.